微波等离子去胶机

Microwave Plasma System For Wafer Processing

ü 晶圆表面活化
ü 光刻胶去除 *带加热盘
ü PI和SU-8等环氧树脂类胶去除 *带加热盘
ü MEMS牺牲层去除PI Release
ü DESCUM打底膜去浮渣

Technical Parameters

 

Temperature control range: 1.9K – 400K continuous control 22

Temperature expansion: 50mK dilution refrigerator

             0.4K He3 Refrigerator

             1000K VSM high temperature furnace

Temperature scanning rate: 0.01 – 8 K/min (non-self-cycling model)

Temperature stability: ±0.2% T < 10K

                 ±0.02% T > 10K

Temperature control mode: fast mode, non-overshoot mode, scanning mode

Magnetic field range: Superconducting magnets included (optional):

              ±9T; ±14T; ±16T

Magnetic field resolution: 0.02 mT to 1 T

                 0.2 mT to 9 T

Magnetic field stability: 1PPM/hour

Field change rate: 10-200 Oe/s

Remanence: < 5 Oe (9T in oscillating mode)

Magnet operation modes: closed loop mode and drive mode

Magnetic field approach mode: Oscillation mode Non-overshoot mode    

                 Linear Mode Scan Mode

The PPMS platform offers a variety of measurement options

456456