HRP®-260 Stylus Profiler

HRP®-260

HRP^®-260 is a high resolution, cassette-to-cassette stylus profiler offering step height measurement capability from a few nanometers to 300µm. The P-260 configuration supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The HRP^®-260 high resolution profiler configuration offers the same capability as the P-260, plus a high resolution stage that produces scanning results similar to an AFM. The high resolution profiler HRP platform has advanced pattern recognition algorithms that enhance recipe transportability between systems, a key requirement for a 24x7 production environments.

HRP^®-260 high-resolution, cassette-to-cassette stylus profiler offers production proven performance with automated wafer handling capability serving the semiconductor, compound semiconductor, high brightness LED, data storage and related industries. The P-260 configuration supports 2D and 3D high-resolution measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The HRP^®-260 configuration offers the same capability as the P-260, plus a high-resolution stage to measure small features at higher resolution and faster throughput.

HRP^®-260 offers dual stage capability for measurement of nano- and micro-surface topography. The P-260 configuration offers long scan (up to 200mm) capability without stitching, and the HRP^®-260 offers a high-resolution scanning stage for up to 90µm scan lengths. The P-260 achieves excellent measurement stability with a combination of the UltraLite^®sensor, constant force control and ultra-flat scanning stage. The HRP^®-260 enhances the capability with a high-resolution piezoelectric scanning stage. Recipe setup is fast and easy with point-and-click stage controls, low and high magnification optics, and high-resolution digital cameras. The HRP^®-260 supports 2D and 3D surface measurement, with a variety of filtering, leveling, and data analysis algorithms to quantify the surface topography. Fully automated measurements are achieved with automated wafer handling, pattern recognition, sequencing and feature detection.

Features

Step Height: Nanometers to 327µm

Low Force: 0.03 to 15mg

Scan full diameter of the sample without stitching

Video: 5MP high-resolution color camera

Arc Correction: Removes error due to arc motion of the stylus

Video: In-line low and high magnification optics

Software: Easy-to-use software interface

Production capability: Fully automated with sequencing, pattern recognition and SECS/GEM

Wafer Handler: Automatically loads 75mm through 200mm opaque (e.g., silicon) and transparent (e.g., sapphire) samples

HRP: High-resolution scanning stage with resolution similar to an AFM

Industries

Wireless Device Manufacturing for SAW, BAW, and FBAR devices

Semiconductor

Compound semiconductor

LED: Light emitting diodes

Solar

MEMS: Micro-electro-mechanical systems

Data storage

Automotive

And more: Contact us with your requirements

Applications

Step Height: 2D and 3D step height

Texture: 2D and 3D roughness and waviness

Form: 2D bow and shape

Stress: 2D and 3D thin film stress

Defect review: 2D and 3D defect surface topography

■高分辨率样品台

HRP^®-260 utilizes a piezoelectric stage that has 90 x 90µm scan range with 1nm resolution, similar to the capability of an AFM. The high-resolution stage combined with Feature Find can be used to precisely locate the feature of interest, enabling rapid measurement of submicron features for use in a production environment. R&D also benefits from high-resolution 3D scanning, using the HRP^®-260 to measure the impact of changes in process parameters, new layer development, or quantifying the topography of defects when combined with the Defect Review software.

■Upgrade to HRP®-260 Stylus Profiler

The HRP®-240 and HRP®-250 systems can be upgraded to HRP®-260. This upgrade extends the lifetime of your current HRP system, utilizing the latest electronics offered by KLA. The upgrade includes profiler software with algorithms that significantly improve pattern recognition performance and recipe transportability between tools. HRP®-260 systems have roughly double the HRP-240 system throughput, based on a production five-site sequence recipe. The upgrade kit includes a new computer with Windows® 10, new electronics with USB communication, high-resolution digital cameras, a 23-inch flat screen monitor, and the latest profiler software.

■Stylus Options

-240 and HRP®-250 systems can be upgraded to HRP®-260. This upgrade extends the lifetime of your current HRP system, utilizing the latest electronics offered by KLA. The upgrade includes profiler software with algorithms that significantly improve pattern recognition performance and recipe transportability between tools. HRP^®-260 systems have roughly double the HRP-240 system throughput, based on a production five-site sequence recipe. The upgrade kit includes a new computer with Windows^®10, new electronics with USB communication, high-resolution digital cameras, a 23-inch flat screen monitor, and the latest profiler software.

■Sample Chucks

HRP^®-260 has a range of chucks available to support application requirements. The standard is a vacuum chuck for measuring samples from 75mm to 200mm. A stress chuck is available with 3-point locators that support the sample in a neutral position for accurate bow measurements. Additional options for bowed wafer sample handling are available.

■Handler Options

HRP^®-260 handler includes an aligner for opaque wafers (e.g., GaAs) and a cassette station for 200mm wafers. Options include transparent sample alignment (e.g., sapphire), smaller sample sizes from 75mm to 150mm, a second cassette station, a cassette slot mapper, and a signal tower.

■Step Height Standards

HRP^®-260 uses thin and thick film NIST traceable step height standards offered by VLSI Standards. The standards feature an oxide step on a 200mm Si wafer. A step height range of 8nm to 100µm is available.

■Apex Analysis Software

Apex 分析软件通过一套配带拉平，过滤，台阶高度、粗糙度和表面形貌分析技术的扩展组件增强了HRP-260的标准数据分析能力。Apex支持ISO粗糙度计算方法以及当地标准，例如ASME。Apex还可以作为报告编写平台，能够添加文本、说明和通过/失败标准。Apex支持11种语言。

■Offline Analysis Software

The HRP®-260 offline software has the same data analysis and recipe creation capability that exists on the tool. This enables the user to create recipes and analyze data without using valuable tool time.

■Pattern Recognition

Pattern recognition uses pre-taught patterns to automatically align the sample. This enables fully automated measurements for enhanced measurement stability by reducing the impact of operator error. Pattern recognition combined with advanced calibrations reduces stage positioning error and enables seamless transfer of recipes between systems.

■SECS/GEM and HSMS

SECS/GEM and HSMS communications support factory automation systems and enable remote control of the HRP®-260. Measurement results are automatically reported to host SPC systems, plus alarms and key calibration/configuration data. The HRP®-260 is compliant with SEMI standards E4, E5, E30, and E37.

■Step Height

HRP^®-260 is capable of measuring 2D and 3D step heights from nanometers to 327µm. This enables quantification of material deposited or removed by processes, including etch, sputter, deposition, spin coatings, CMP and other processes. The HRP^®-260 has constant force control that dynamically adjusts to apply the same force, regardless of step height. This results in good measurement stability and enables accurate measurement of soft materials, such as photoresist.

■Texture: Roughness and Waviness

HRP^®-260 measures 2D and 3D texture, quantifying the sample’s roughness and waviness. Software filters separate the measurement into roughness and waviness components and calculate parameters, such as the root mean square (RMS) roughness.

■Form: Bow and Shape

HRP^®-260 can measure the 2D shape or bow of a surface. This includes measurement of wafer bow that can result from mismatch between process layers during device fabrication, such as the deposition of multiple layers for the production of semiconductor or compound semiconductor devices. The HRP^®-260 can also quantify the height and radius of curvature of structures, such as a lens.

■Stress: 2D and 3D thin film stress

HRP^®-260 is capable of measuring the stress induced during the manufacture of devices with multiple process layers, such as semiconductor or compound semiconductor devices. The bow of the sample is accurately measured using a stress chuck to support the sample in a neutral position. The change in shape from a process, such as film deposition, is used to calculate the stress by applying Stoney’s equation. 2D stress is measured with a single scan across the sample diameter up to 200mm without the need to stitch. 3D stress is measured using a combination of 2D scans, with the theta stage rotating between scans to measure the full sample surface.。

■Defect Review

Defect Review is used to measure the topography of defects, such as the depth of a scratch. Defect inspection tools identify defects and write the location coordinates to a KLARF file. The Defect Review feature reads the KLARF file, aligns the sample, and allows the user to select defects for 2D or 3D measurement.

KLA_AppNote_Stylus_SIMS_Crater.pdf