Model 200 Mask Alignerand UV Exposure System

Mask Aligner and UV Exposure System

Model 200 UV Mask Aligner is designed and manufactured by OAI.
The OAI Model 200 can be configured with an OAI Nano Imprint Module making it the lowest cost NIL tool available. OAI also offers a module designed for using liquid photoploymers for rapid prototyping or production of microfluidic devices.

Model 200 Mask Alignerand UV Exposure System

 

The OAI Model 200 Mask Aligner and UV Exposure System is a cost-effective high performance tool that is engineered with the industry proven modular components that make OAI a leader in the MEMS, Nanotechnology and Semiconductor equipment industries. The Model 200 is a bench top model that requires minimal clean room space. It offers an economic alternative for R&D, pilot, or low volume production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently for parallel photomask alignment and uniform contact across the wafer during contact exposure. The system is capable of micron resolution and alignment precision. The Alignment Module features mask insert sets and quick-change wafer chucks that allow the use of a variety of substrates and masks without requiring tools for reconfiguration. The Alignment Module incorporates micrometers for the X, Y, and θ axes. The Model 200 Aligner can be fitted with a wide range of alignment optics including backside IR. The IR illumination vacuum chuck can be configured for alignment of whole wafers or pieces. The OAI Model 200 can be configured with an OAI Nano Imprint Module making it the lowest cost NIL tool available. OAI also offers a module designed for using liquid photoploymers for rapid prototyping or production of microfluidic devices.
The Model 200 features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the Constant Intensity Controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily.

———————————————————————————————

 

Applications:

MEMS

NIL

Microfluidics

Nanotechnology

II-VI & III-V device fabrication

Multi-level resist processing

LCD and FED displays

MCM’s

Thin film devices

Solar cells

SAW devices

 

Options

Available with single or dual cameras and screens (Dual camera / dual screen version shown in photo) May be fitted with Nano Imprint Module for NIL May be fitted with Module for Microfluidics

 

Features

Small Footprint

Vacuum Chuck

Precision Alignment Module

Interchangeable Mask Holders and Substrate Chucks

 

Benefits

Requires minimal clean room space ■ Causes minimal damage to fragile substrate materials ■ Accurate alignments to 1 micron ■ Easily accommodates a wide variety of substrates and masks ■ Backside mask alignment of IR transparent wafers with accuracy up to 3-5 microns ■ Highly collimated, uniform UV light ■ Quickly change the UV light wavelength ■ Exposure controlled intensity to ±2% ■ Can be configured as a Nano Imprint tool for NIL ■ Can be configured with a Microfluidics Module

 

 

Model 200 紫外掩膜曝光机

 

 

Specifications

 

 

 

Related Products

related news

contact us

我们希望了解您的需求,请填写以下表单并提交

Your Name
邮箱地址
联系电话
您的需求