Model RSS-Series
RSS-110-S / RSS-160-SC / RSS-210-SC / RSS-210-SC
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Applications
Reflow Solder Processes (fluxless)
Lead free and void free soldering
Operation with inert gas, Oxygen gas, Hydrogen gas, Forming gas,
Formic Acid (depends on model)
Features
Precise ramp up and fast ramp down rates
Excellent temperature uniformity
One gas line (Mass Flow Controller) with 5 nlm Nitrogen
Data logging (USB, Ethernet)
Hotplate heated by heater cartridges or IR lamps and cooled with water
50 programs with 50 steps each
Small foot print
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Process Gases
Beside standard process gases, like Nitrogen, Oxygen, Forming
Gas the system (depends on model) can also be used with pure
Hydrogen (Option: H2 and HS2). The chamber is sealed and can
be easily cleaned. The Option RSS-FA allows the use of formic
acid for void free solder results.
Flow Control
One gas line with Mass Flow Controller (MFC) is default. Options like Formic Acid Module (RSS-FA ) or use of 100 % Hydrogen (RSS-H2) are controlled by an own Mass Flow Controller
or with a shared gas line.
Vacuum
The system is vacuum capable to 10-3 hPa. A membrane/diaphragm pump, a chemically resistant pump (recommended
when RSS-FA is used) and a rotary vane pump are available as
accessories.
Temperature Distribution
The max. temperature is 400 °C (optional up to 500 °C). Key
features are precisely controlled fast ramp-up (up to 240 K/min.
depending on model) and ramp-down rates (up to 120 K/min).
The hot plate offers an excellent temperature distribution and
homogenity
Programmig
The systems are equipped with a 7“ touch panel which allows
easy and comfortable programming directly on the unit.
50 programs with 50 steps each can be stored. Unlimited programs can be up – and downloaded from an external storage
medium.
Process Control
The software allows the permanent monitoring, read- out and
analysis of
Cooling
The hot plate is water cooled. An external water cooling is required (we recommend a closed loop water cooling system)
