With over 4 decades of manufacturing in the semi-
conductor industry,OAl meets the growingchallenge of a dynamic market with a newelite class of production photolithogra-phy equipment.Built on the proven OAImodular platform,the Model 6000 is a fullyautomated cassette to cassette system withsub-micron resolution which delivers per-formance that is unmatched at any price.
The aligners have Advanced Beam Op-tics with better than ±3%uniformity and athroughput of 200 wafer per hour in FirstMask Mode,which results in higher yields.
The Model 6000 can handle a wide varietyof wafers from thick and bonded substrates(up to 7000 microns),warped wafers (up to7 mm-10mm),thin substrates (down to 100micron thick),and thick photo resist.Withsuperb process repeatability,the Model6000 is the perfect solution for all produc-tion environments.
Choose either top sideor optional back side alignment which usesCognexT Pattern Recognition software withOAI's pattern assist software.This unique soft-ware improves total throughput.For the totallithography process,the Model 6000 can be in-tegrated seamlessly with cluster tools.OAl's newproduction mask aligners are the total package.
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HIGHLY OPTIMIZED YIELDS
200 WPH in 1st Mask Mode
Advanced Beam Optics with
better than ±3%Uniformity
WIDE VARIETY OF WAFER HANDLING
Including thick &bonded substrates andwarped substrates
WEDGE EFFECT LEVELING
SUPERB PROCESS REPEATABILITY
SUB MICRON RESOLUTION
REMOTE DIAGNOSTICS
R Auto-align
Cassette Mapping
UV LED Exposure Light Sources
Temperature Controlled Wafer Chuck
Integrated Mask Management Control
Integrated Lithography Cluster for Full Lithography
Process Environment Control with SMIF or FOUP Interface Modules
Non-contact Leveling
Edge Gripping
Laser Gap Measurement
