Features
DIE & SUBSTRATE
die size
Minimum die size 70*70µm
Maximum die size 15*15 mm
VISION SYSTEM
Digital Zoom , UHD Display Monitor
Video Microscope UHD cameras, 5Mp
Offset : field area, adjustable
Full std FOV
Full std FOV = 14,7mm
Direct placement of Face-up devices
Digital Zoom , UHD Display Monitor
Monitor : TFT 22’’
Lighting System
Led Lighting , co-axial and oblique
Direct placement of Face-up devices
XY TABLE
Vibration Resistance Design
Vibration free
Motion Control
Motion control with micrometer XY
Compatibility
Compatible for any package up to 100 mm
Thick.
Precision Calibration
Fine rotary stage for precise alignment
Placement Accuracy
Placement accuracy <+/5 µm.
Depending process
Explanation of Key Parameters
The equipment can handle bonding requirements ranging from micro-scale small chips to centimeter-scale large chips. The vision system ensures positioning accuracy through high-resolution cameras and adjustable lighting, while the anti-vibration design and micro-scale control of the XY worktable guarantee the stability and precision of chip placement. It is suitable for high-precision semiconductor packaging or electronic component assembly scenarios.
Technical Specification
Electrical Requirements：100 / 240V , 50-60Hz
Current：max. 5A
Dimensions:640x710x550mm,
(23’’x21’’x19’’)
Weight：60 kg
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OPTIONS
Eutectic head with controller
Core Parameters and Characteristics
Temperature Compatibility
Compatible from room temperature up to 400°C
Temperature Profile Control
3 programmable ramp-up
Temperature Ramp-up: >4K/s
heated block cooling ：It integrates an efficient heat dissipation design, supporting rapid cooling after welding to prevent chips from being damaged by overheating.
Power Supply Specifications
Low-Voltage Power Supply: 48V/350W, compatible with industrial-grade low-voltage safety standards, reducing energy consumption and heat generation.
Application Scenarios
Large-Size Chip Design: Optimized specifically for the bonding of large-area chips (such as power devices and sensor arrays) to ensure temperature uniformity.
Bonding Head Structure: Equipped with a bonding head shank with a diameter of 8mm, it provides sufficient mechanical support and meets the crimping requirements of extra-large size chips.
Core Functions and Technical Parameters
Operating Modes
Manual Control: Supports foot switch triggering for one-handed operation (e.g., holding the dispensing head to align, and controlling glue dispensing via the foot switch).
Automation Compatibility: Can be upgraded to Programmable Logic Controller (PLC) control, supporting timed/quantitative/path-based glue dispensing
Dispensing Principle
Epoxy Resin (Epoxy): Viscosity range of 500~50,000 cP (a heating module is required to handle high-viscosity materials)
Solder Paste: Tin-lead / lead-free alloy, with a metal content of 85%~92%
Pressure-Time Control: Precisely control the glue output by adjusting air pressure (0.1~10 bar) and time (1~9999 ms)
Applicable Materials:
Capacity Specifications
Supports 3CC or 5CC standard syringes (Seringue), adapting to different mass production requirements
Covered Heating Workbench – Reflow Soldering Series
HP-60 Heated Workholder 60mm diameter
HP-100 Heated Workholder 100 x100 mm
HP-150 Heated Workholder 150 x 100 mm
HP-200 Heated Workholder 200 x 150 mm
