NanoFlip Nanomechanical Tester

Nanoflip

The NanoFlip nanoindenter measures hardness, modulus, yield strength, stiffness and other nanomechanical tests with high accuracy and precision under both vacuum and ambient conditions. In both scanning electron microscope (SEM) and focused ion beam (FIB) systems, the NanoFlip excels at tests, such as pillar compression, while synchronizing the SEM images with the mechanical test data. The NanoFlip is a compact, flexible in situ nanomechanical tester that performs fast measurements, which are key to testing heterogeneous materials in inert environments (e.g., glove boxes). The NanoFlip in situ nanomechanical tester's suite of options available, such as the InForce 50 electromagnetic actuator, combine to deliver quantitative results that lead to valuable solutions in material research.

The NanoFlip universal nanomechanical tester has a high precision XYZ motion to position the sample for testing and a flip mechanism to position the sample for imaging. The InView software comes with a suite of test methods that cover a range of test protocols, and also allows users to create their own novel test methods. The capability to add custom formulas and test sequences helps the user achieve universal nanomechanical testing. The InForce 50 actuator performs equally well in both vacuum and ambient conditions. SEM or other microscope images can be recorded by the InView software and synchronized with the mechanical test data. The revolutionary FIB-to-Test technology allows tilting the sample 90°, allowing a seamless transition from FIB to indentation test without having to remove the sample.

Features

Large suite of pre-programmed nanomechanical test methods for improved ease-of-use

InQuest high-speed controller electronics with 100kHz data acquisition rate and 20µs time constant

XYZ motion system for sample targeting

SEM video capture for synchronized SEM images with test data

Unique software-integrated tip-calibration system for fast, accurate tip calibration

InView control and data review software with Windows^®10 compatibility and method developer for user-designed experiments

Industries

Semiconductor industry

Pillar and microsphere manufacturing

MEMS: Micro-electro-mechanical systems

Materials manufacturing (structure compression/tensile/fracture testing)

Battery and component manufacturing

Applications

In situ materials research

Hardness and modulus measurements (Oliver-Pharr)

High Speed Material Property Maps

ISO 14577 hardness testing

Polymer dynamic mechanical analysis

Quantitative scratch and wear testing

■连续刚度测量（CSM）

Continuous stiffness measurement is used to quantify dynamic material properties, such as strain rate and frequency-induced effects. The CSM technique involves oscillating the probe during indentation to measure properties as a function of depth, force, time, or frequency. The option comes with a constant strain rate experiment that measures hardness and modulus as a function of depth or load, which is the most common test method used across academia and industry. CSM is also used for other advanced measurement options, including the ProbeDMA™ method for storage and loss modulus measurements and AccuFilm™ substrate-independent measurements. The CSM is integrated into the InQuest controller and InView software to deliver ease of use and data quality.

■Gemini2D多轴作动器

Gemini多轴技术，保证增加的横向轴与常规压痕具有相同的性能，且CSM能够在两个方向同时工作。基于这项专利技术获得更多测试结果，有助于形成对材料特性和失效机制新的认知。横向力和摩擦学测量可以通过双轴作动器实现，其可以用于测量泊松比、摩擦系数、划痕、磨损、剪切特性和形貌特征。

■NanoBlitz 3D

NanoBlitz 3D utilizes the InForce 50 or InForce 1000 actuator and a Berkovich tip to generate 3D maps of nanomechanical properties for high-E (> 3GPa) materials. NanoBlitz performs up to 90,000 indents (300×300 array) at < 1s per indent, and provides Young’s modulus (E), hardness (H), and stiffness (S) values at a specified load for each indent in the array. The large number of tests enables increased statistical accuracy. Histogram charts show multiple phases or materials. The NanoBlitz 3D package includes visualization and data handling capabilities.

■NanoBlitz 4D

NanoBlitz 4D utilizes the InForce 50 or InForce 1000 actuator and a Berkovich tip to generate 4D maps of nanomechanical properties for both low-E/H and high-E (> 3GPa) materials. NanoBlitz performs up to 10,000 indents (100×100 array) at 5-10s per indent, and provides Young’s modulus (E), hardness (H), and stiffness (S) values as a function of depth for each indent in the array. NanoBlitz 4D utilizes a constant strain rate method. The package includes visualization and data handling capabilities.

■AccuFilm™ Thin Film Method Pack

The AccuFilm Thin Film Method Pack is an InView test method based on the Hay-Crawford model for measuring substrate-independent material properties using Continuous Stiffness Measurement (CSM). AccuFilm corrects for substrate influence on film measurements for hard films on soft substrates, as well as for soft films on hard substrates.

■ProbeDMA™ Polymer Method Pack

The Polymer Pack provides the ability to measure the complex modulus of polymers as a function of frequency. The pack includes a flat-punch tip, a viscoelastic reference material, and a test method for evaluation of viscoelastic properties. This measurement technique is key to characterizing nanoscale polymers and polymer films that are not well-served by traditional dynamic mechanical analysis (DMA) test instruments.

■Biomaterials Method Pack

The Biomaterials Method Pack provides the ability to measure the complex modulus of biomaterials with shear moduli on the order of 1kPa, and utilizes Continuous Stiffness Measurement (CSM). The pack includes a flat-punch tip and a test method for evaluation of viscoelastic properties. This measurement technique is key to characterizing small scale biomaterials that are not well-served by traditional rheometer instruments.

■Scratch and Wear Testing Method Pack

Scratch testing involves the application of either a constant or ramped load to an indenter while moving across the sample surface at a specified velocity. Scratch testing allows characterization of numerous materials such as thin films, brittle ceramics and polymers.

■DataBurst

DataBurst enables systems equipped with InView software and the InQuest controller to record displacement data at rates > 1kHz for measuring high strain step loads, pop-in and other high speed events. iMicro systems outfitted with the User Method Development option can also modify methods to work with DataBurst.

■User Method Development for InView Control Software

InView is a powerful, intuitive experiment-scripting platform that can be used for designing novel or complex experiments. Experienced users can set up and perform virtually any small-scale mechanical test using the iMicro system equipped with the exclusive InView option.

■True Test I-V Electrical Measurements

The I-V option of the NanoFlip Nanoindenter is controlled via the InView software, and it includes a precision current/voltage source meter, a conductive path through the indenter and the InForce 50/1000 actuator, as well as a conductive indenter. This design ensures that users can apply a specific voltage to the sample, measure the current passing through the indenter, and simultaneously operate the InForce actuator to perform mechanical tests.

■Indenter Tips and Calibration Samples

A variety of sharp indenters are available, such as Berkovich, cube corner, and Vickers indenters. Flat indenters, spherical indenters, and indenters of other geometric shapes are also offered. Standard samples and calibration standards are provided for the entire product series.

■Coating Hardness and Modulus Measurements (Oliver-Pharr)

The NanoFlip nanoindenter measures hardness and modulus for a wide variety of materials, from ultra-soft gels to hard coatings. The high throughput assessment of these properties enables quality control and assurance on production lines.

■Continuous Stiffness Measurement (CSM)

The CSM technique involves oscillating the probe during indentation to measure properties as a function of depth, force, time, or frequency. The option comes with a constant strain rate experiment that measures hardness and modulus as a function of depth or load, which is the most common test method used across academia and industry. CSM is also used for other advanced options, including the ProbeDMA™ method for storage and loss modulus measurements and AccuFilm™ substrate-independent measurements. The CSM is integrated into the InQuest controller and InView software to deliver unparalleled ease of use and data quality.

■High Speed Material Property Maps

For composite materials, the mechanical properties may vary widely from one area to the next. NanoFlip nanomechanical testers provides a sample stage movement of 21mm in the X and Y axes, and 25mm in the Z axis, allowing in situ mechanical testing of a wide range of sample heights over a sample area. The optional NanoBlitz Topography and Tomography software can quickly generate color maps of any of the measured mechanical properties.

■Yield stress/strain

The NanoFlip nanoindenter includes a pre-written ISO 14577 test method to measure material hardness in compliance with the ISO 14577 standard. This test method automatically measures and reports Young’s modulus, instrumented hardness, Vickers hardness and normalized work-of-indentation.

■Quantitative scratch and wear testing

The NanoFlip can perform scratch and wear testing on a variety of materials. Coatings and films are subjected to many processes, such as chemical and mechanical polishing (CMP) and wire bonding, that test the strength of these films and their adhesion to the substrate. It is important for these materials to resist plastic deformation during these processes and remain intact without blistering up from the substrate.

KLA_AppNote_Stylus_SIMS_Crater.pdf