Vacuum Solder System Model VSS-450-300
VSS-300 / VSS-300-HV
- Programmable temperature profiles
- Process Data Logging
- Process operations can be performed under different gas atmospheres
The VSS – 300 Reflow Soldering System is a high-quality device suitable for a variety of soldering processes. It can handle wafers with a diameter of up to 300 mm, or substrates with dimensions of 300 mm × 300 mm and a height of 70 mm (with the optional "EH" configuration, the height can reach 120 mm).
It can be used as a laboratory furnace, serving various R&D personnel in the implementation and research of new processes, prototype research, environmental research, as well as small-batch trial production or mass production.
The VSS – 300 can use standard process gases such as nitrogen, oxygen, and forming gas. The chamber is well-sealed and easy to clean.
The default configuration includes 1 nitrogen gas line with a Mass Flow Controller (MFC) (5 standard liters per minute), and an additional maximum of 3 gas lines with MFCs can be optionally added.
The system's vacuum level can reach 10⁻³ hectopascals (and up to 10⁻⁶ hectopascals with optional configuration).
- The maximum achievable temperature is 450℃ (650℃ with optional configuration).
- It features key characteristics such as rapid heating with precise control (150 K/min) and excellent cooling rate (depending on temperature and load conditions).
The VSS – 300 achieves excellent temperature distribution and uniformity. A graphite susceptor can be optionally inserted on the quartz base plate.
The VSS – 300 is controlled by an SPS SIMATIC® controller. The 7-inch touchscreen enables highly convenient process programming and control. It can store up to 50 programs, with each program containing 50 steps (an unlimited number of programs can be downloaded from and uploaded to external data storage devices).
The software enables continuous monitoring, reading, and analysis of the following parameters:
- temperature
- process gas flow
- cooling water level status
- pressure value and status
The hot plate adopts a double-sided uniform active cooling method.
- It is default equipped with an interlock function and an emergency stop button (EMO).
This furnace can also be integrated into production lines. The opening/closing of the chamber is realized via button operation.
