Model RSS-3X210 | Compact Reflow Solder System with 3 heated zones
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Precise ramp up and fast ramp down
rates
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Up to 4 internal gas lines
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Data logging
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hard coated heating plate with lift pins
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SIMATIC controller with 7" touch
panel
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Small Footprint
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Reflow Solder Processes without flux
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Operation with inert gas, Oxygen,
Hydrogen , Forming gas, Formic Acid
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Lead free soldering
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Resistor paste firing
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Vacuum Soldering oven as table top version
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Programmable temperature profiles
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Record of process data
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Process in different gas atmospheres (inert gases)
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Perfect lab tool for small production purpose
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RSS-3X210 Reflow Solder
System is an excellent tool for various
solder processes up to 100 mm
diameter wafer (12 pcs in one run).
Some examples for applications:
Beside standard process gases, like
Nitrogen, Oxygen, Forming Gas the
system can also be used with pure
Hydrogen (Option: H2 and H2S). The
chamber is sealed and can easily be
cleaned.
One gas line with Mass flow controller
for the process gas is default, one
more gas line (Option: MFC) is
possible.
The system is vacuum capable of up to
10-3 hPa.
The maximal achievable temperature
is 300 °C).
The hot plate allows an excellent
temperature distribution and.......
homogenity
The RSS-3X210 is equipped with a
SIMATIC controll with 7" touch panl.
This allows the programming directly
on the unit or by using the USB
i n t e r f a c e a n d c o m f o r t a b l e
programming on a PC. It is possible to
store 50 programs with 50 steps each.
The hot plate is active cooled. For
chamber housing cooling an external
cooling is required (we recommend a
chiller (Accessories: WC-II)
