JFP Scriber S200

The design of the S200 Semi-Automatic Scriber and Breaker emphasizes user-friendliness. It can efficiently achieve the singulation (cutting and separation) of components in various sizes, features a simplified operation process, and is adaptable to the mass processing needs of chips with different specifications.

Ease of Use for Singulation

The Scriber Model S200 is designed to be user-friendly, allowing efficient singulation of components of various sizes.

Robust and vibration free

the scriber is immediately operational, with minimum training.

Vertical Targeting with Video Set

Vertical targeting is facilitated using a video set that includes the JFP crosshair and digital zoom.

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SCRIBING HEAD

Z motion with adjustable angle

Adjustable scribing force from 5g up to 80g; constant weight, Additional weight in option

Diamond Tool: Adjustable for angle & rotation

Tool Offset with JFP crosshairs

WAFER TABLE

Wafer chuck till 2” up to 8”

Hold by vacuum

Frame / Ring adaptor

Die Size: Minimum 100µm square up to 150mmx150mm

Continuous Motorized Rotation / Programmable angle

Rotation alignment Mode in 2 points

X Y Table / display : 1 µm, accuracy ± 5 µm

Motion control with progressive joystick weight

VISION SYSTEM

Optics & magnification compatible with application

TFT monitors 22’’ and Color camera Ultra High definition

Electronic Zoom X10

LED lighting

Option : CAMERA PROCESS for scribe tool inspection.

 

PARAMETERS

7" touch screen

Step Index and vertical interval

Y scribe speed from 0.1 to 100 mm/sec

Scribing length programmable

Repeat scribe

Number of scribe

Component number

Touchdown speed

Scribe counter

 

MATERIALS

Silicon, LED GaAs,

Alumina, thin glass, Borosilicate, Sapphire

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Technical Specification

Power:100 / 230VAC 1 kWatt

Air:80psi

Vacuum:100%, flow =15l/min

Dimensions:650x820x1500mm (25x32x60)

Weight:70kg
 

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