Small Footprint Desktop System

Semiconductor-grade metal sealed lines and high temperature compatible fast pulsing ALD valves.

Ultrafast MFC for integrated inert gas purge.

6 inch circular chuck (up to 7″ square) customizable for smaller sizes or other shapes (11 mm tall).

3 organometallic precursors and 2 (up to 3) counter reactants.

Heated lines throughout (from precursor to chamber).

All aluminum (semiconductor grade) chamber ‒ range up to 300°C

7” touchscreen PLC controller (no PC required).

Features

• Small Footprint Desktop System, cleanroom compatible.

• All aluminum (semiconductor grade) chamber ‒ range up to 300°C

• High temperature semiconductor grade fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge.

• 8″ circular chuck customizable for smaller sizes or other shapes.

• Streamlined chamber design and small chamber volume

• 3 organometallic precursors and 2 (up to 3) counter reactants.

  • Precursors can be heated to 150°C.

• Heated lines throughout (from precursor through to chamber).

• Simple system maintenance and lowest utilities and precursor usage on market

• High exposure (for trenches and porous substrates) and static processing mode

• 7 ” touchscreen PLC controller (no PC required)

Specifications

• Chamber temperatures from RT to 300°C ± 1°C

• Precursor temperatures from RT to 150°C ± 2°C (w/ heating jacket)

• Smallest footprint on market, bench top installation and cleanroom compatible

• Simple system maintenance and lowest utilities and precursor usage on market

• Streamlined chamber design and small chamber volume

• Fast cycling capability and high exposure, deep penetration processing available

• All metal sealed from precursor to chamber.

• Typical Operating Pressure

• Full HW and SW interlocks for safe operation in multi-user environment

• 110 – 220 VAC, single phase, 50/60Hz, 15 Amp (10A for 220V)

• Weight approximately 100lbs (45 kgs)

OPTIONS

• Customized chuck/platen (square, indents for smaller pieces, powders)

• Customized chamber (thicker substrates)

• ATOzone – Ozone generator (required for some films: Pt, Ir, SiO2, MoO2, high quality Al2O3 below 60°C, high quality HfO2)₂、MoO₂high quality Al2O3 below 60°C₂O₃、high quality HfO2₂）

  • Optional – Ozone Safety Monitor w real time detection of ambient ozone gas

• QCM (Quartz Crystal Microbalance)

• Glovebox integration (typically required to not expose substrate to moisture; Sulfides, etc..)

• External control – PC/software link (allows programming and running, remotely)

• Ventable Precursor cabinet

• Spare Chamber

• IGPA (inert gas pressure assist)for low vapor pressure precursors

• Higher temperatures on precursors (to 180°C)

• Third counter reactant

  • Software control of third counter reactant

Installation

• • • For detailed instructions see our presentation and video instructions: “AT810 Installation and Start-up“

    • N₂ purge gas should be >99.9995% with a shutoff valve (regulated to 10 – 30 psi, metal sealed), .

      • Input line is 1/4 female VCR compression fitting

      • Attach > 99.9995% nitrogen (UHP) purge gas via 1/4″ metal line to the 1/4″ compression fitting on back

    • Attach 90-110 psi CDA (clean dry air) via 1/4″ polyethylene tubing or metal line to the other 1/4″ compression fitting marked CDA (Clean Dry Air)

    • Min 19.5cfm wet pump (**PTFE vacuum fluid (like Fomblin) required)

      • NW25 (KF25) (1″) connection and also exhaust line (with > 5cfm draw)

      • Greater than 1 meter should use NW40 (1.5″) exhaust line

    • Precursor’s attach via female VCR elbows (always use new gaskets)

      • Elbow: 1/4″ gasket first (with gloves on)

    • For precursor attachment please refer to “AT810 Tool and Software Operation”.

Software

• For detailed instructions see our presentation and video instructions: “AT810 Installation and Start-up“

  • Input subcycles and overall cycles

  • Human Machine Interface (HMI) PLC system with a 7” touch screen panel

  • Advanced controls suitable for the deposition of standard ALD cycles as well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films

  • Recipe database for high quality, tested processes

  • Custom recipe input screen

  • Real time display of process status

  • Individually programmable heated source temperatures

  • Built-in pulsing sequences for ternary compounds and nano-laminates

  • Quick running with simple questions to get user going