PP7-3D通用型芯片键合机

The PP7-3D Universal Chip Bonder is a bonder device specifically designed for placing precision components on multi-layer reference packages.

JFP PP7-3D Multi level Die BonderFeatures

Programmable Focus = 20mm

Orthogonal and Co-Axial Motions

Related to reference base/Planarity

Regular alignment reference points

Circular Shape Alignment Reference

JFP PP7-3D Multi level Die BonderSpecifically designed for placing precision components on multi-layer reference packages

Ultra-High-Definition Optical Positioning:PP7 achieves high accuracy placement using UHD optical device.
Programmable Vertical and Coaxial Focus Cameras:Programmable Vertical and co-axial Focusing camera make alignment references level, completely independent of bonding Heights.
Vertical Vision and Placement System:Vision and placement are fully perpendicular to surface reference base of package.
Compatibility with Precision Components:Handling and centering is compatible with very delicate devices, as large I.R sensors, or MEMS...
Anti-External Vibration Design:A robust, and reliable mechanical concept, designed to be external vibration free.
Ergonomic Optimization:Easy to use, flexible, the PP7 requires only minimum training to operate.

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