The Model 6020 is a large area Fully automated
production Mask Aligner or Auto-Flood Exposure System
engineered for RDL First Panel Level Advanced Packaging
(PLP) and markets requiring exposure of large glass panels.
Using OAI’s advanced beam optics, the Series 6020 utilizes
a UV light source with beam size from 12”sq to 20i”sq
using while applying 1KW – 8KW lamp powers. This
provides a uniform beam of ≤3 to 5%.In mask aligner mode
the system enables a printing resolution of ≤2.0um .
Topside / Bottom Side Alignment
High throughput
1KW – 8KW Collimated Beam Light
Source from 12”sq – 20”sq Beam
Sizes
3-5% Light Source Beam Uniformity
High Speed Encoders & Motors for
Auto-alignment
SECS / GEM Capability
Wide Variety of Panel Handling
12”sq to 20”sq Panels
Stepper Chuck Option for Sub-Panel
Processing
14”sq to 24”sq Mask Inserts
WEDGE EFFECT LEVELING
SUPERB PROCESS REPEATABILITY
<2.0um PRINTING RESOLUTION
REMOTE DIAGNOSTICS
——————————————————————————————————————
Features
-
High-Precision Alignment System: Optional Smart Cam high-resolution CCD camera system, combined with OAI pattern recognition software, enables accurate automatic top-side alignment and user-friendly operation.
-
Flexible Substrate Handling Capability: Supports a wide range of substrate thicknesses, from ultra-thin to ultra-thick, as well as bonded panels. The substrate chuck features XYZ axis and θ angle movement functions, including a stepping function, enabling handling of full-size panels or sub-panels tiled on large panels.
-
Automated Integration Solution: Adopts a robotic loading and unloading system, which can operate independently or be integrated with photoresist processing equipment.
-
Process Stability Assurance: The OAI 6020 Series delivers excellent performance in terms of performance, reliability, and repeatability, making it an ideal choice for advanced redistribution layer (RDL)-first panel-level packaging (PLP) production and large-area glass panel exposure.
