RSO-210 | Reflow Solder Oven with Vacuum

Reflow Solder Oven with Vacuum

The applicable substrate size is 210 mm × 210 mm or 8-inch wafers. Maximum temperature: 650°C. Maximum heating rate: 10 Kelvin per second. Vacuum degree up to 10⁻³ hectopascals. Process gas path with a mass flow controller for nitrogen. Equipped with a SIMATIC® controller with a 7-inch touch screen.

RSO-210 | Reflow Solder Oven with Vacuum

 

Applications

The RSO-210 Reflow Solder System is an excellent tool for various solder applications up to 210 x 210 mm or 8” wafer substrate size.
Many reflow soldering applications require an inert process area (oxygenfree) within the reflow oven. The gas used to purge the chamber of oxygen is typically nitrogen. The two advantages of a nitrogen inert reflow process are as follows:
Nitrogen replaces oxygen, and due to its inert (non-reactive) nature it provides greater profile flexibility and widens the process window.
Some examples for applications:

Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small preseries or series.
 

Process Gases

The RSO-210 can be used with standard process gases, like Nitrogen, Oxygen and Forming Gas. The chamber is sealed and can easily be cleaned.
 

FLOW METER

One gas line with Mass Flow Controller (MFC) for Nitrogen (5 nlm) is default, three more gas lines (Option: MFC) are possible.
 

Vacuum

The system is vacuum capable of up to 10-3 hPa. For higher vacuum we offer the model RSO-210-HV (see separate data sheet).
 

Heating

The maximal achievable temperature is 650 °C . Key features are precisely controlled fast ramp-up rates (10 K/sec) and excellent ramp-down rates (depends on temperature and loading).
 

Temperature Distribution

The RSO-210 allows an excellent temperature distribution and homogeneity. A graphite susceptor is included by default (ramp-up rate limited to 10 K/sec).
 

Programmig

The RSO-210 is equipped with a 7" touch panel which allows easy and comfortable programming directly on the unit. 50 programs with 50 steps each can be stored. Unlimited programs can be up- and downloaded from external storage medium.
 

Process Control

The software allows the permanent monitoring, read- out and analysis of :
  • temperature

  • process gas flow

  • cooling water level status

  • pressure value and status

 

Cooling

The cooling of the parts in the quartz chamber is realized by Nitrogen gas which will be led through the chamber. For cooling of the chamber housing cooling we recommend a closed loop water cooling system. (Accessories: WC-II oder WC-III)
 

Others

An interlock function as well as an Emergency-OFF-Button (EMO) are default.
 

Special

This oven can also be orderd as „double chamber oven“. By adding a second process chamber (Option: RSO-PC-210) the oven does have 2 process chambers and one controller unit. This saves money when 2 different processes are needed and the chambers shall not be cleaned due to contamination or other reasons.

 

 

 

 

 

 

 

 

 

 

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