RSO-300 | Reflow Solder Oven with Vacuum
RSO-300 RSO-300-HV
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Reflow Solder Processes without flux
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Operation with inert gas, Oxygen, Hydrogen, Forming gas, Formic Acid
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Lead and Lead-free SMT reflow
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High temperature ceramic/alumina hybrid reflow
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Pin-in-paste reflow
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Semiconductor
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LED attach
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Precise ramp up and fast ramp down rates
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Up to 4 gas lines
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Heated by Infrared Lamps
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50 programs with 50 steps each
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Integrated data logging
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Small Footprint
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Incl. Quartz glass universal holder and graphite susceptor
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The RSO-300 Reflow Solder System is an excellent tool for various solder applications up to 309 mm x 319 mm x 40 mm
substrate size.
Many reflow soldering applications require an inert process
area (oxygenfree) within the reflow oven. The gas used to
purge the chamber of oxygen is typically nitrogen. The two advantages of a nitrogen inert reflow process are as follows:
Nitrogen replaces oxygen, and due to its inert (non-reactive)
nature, provides greater profile flexibility and widens the
process window.
Some examples for applications:
Laboratory furnace for all kind of developers implementing and
researching new processes, prototype research, environmental
research purposes and for small preseries or series.
The RSO-300 can be used with standard process gases, like Nitrogen, Oxygen and Forming Gas. The chamber is sealed and
can easily be cleaned.
One gas line with Mass Flow Controller (MFC) for Nitrogen (5 nlm)
is default, three more gas lines (Option: MFC) are possible
The system is vacuum capable of up to 10-3 hPa. For higher
vacuum we offer the model RSO-300-HV
The maximal achievable temperature is 650 °C . Key features
are precisely controlled fast ramp-up 10 K/sec) and excellent
ramp-down rates (depends on temperature and loading).
The RSO-300 allows an excellent temperature distribution and
homogeneity. A graphite susceptor is included by default
(ramp-up rate limited to 10 K/sec).
The RSO-300 is equipped with a 7" touch panel which allows
easy and comfortable programming directly on the unit.
50 programs with 50 steps each can be stored. Unlimited programs can be up- and downloaded from external storage medium.
The software allows the permanent monitoring, read- out and analysis of :
The cooling of the parts in the quartz chamber is realized by
Nitrogen gas which will be led through the chamber. For cooling
of the chamber housing cooling we recommend a closed loop
water cooling system. (Accessories: WC-II oder WC-III)
An interlock function as well as an Emergency-OFF-Button
(EMO) are default.
This oven can also be orderd as „double chamber oven“. By
adding a second process chamber (Option: RSO-PC-300) the
oven does have 2 process chambers and one controller unit.
This saves money when 2 different processes are needed and
the chambers shall not be cleaned due to contamination or
other reasons.
