JFP WB 100-e MANUAL & SEMI-AUTOMATIC WIRE BONDER
The WB 100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production.
The WB 100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production.
The WB 100-e is designed as a multi-purposes semi automatic wire bond tool
for R&D purpose, prototype and small series production.
Flat bench Top size to allow easy carriage and operation.
Optional, Full Manual Z mode for simple repair, not program dependent.
Loop Profile with motorized Y
Higher z resolution and increased Z travel for higher flexibility and sensitivity
for very fine wire, required by worldwide laboratory requirements.
Versatile wire bond tool.
Perfect ergonomic design.
Easy setup and high flexibility for multiple application.
Extra spare to be used as storage and wire identifier purposes
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