JFP Scriber S100
The Scribe 100 is an unique machine designed for scribing & breaking of delicate die,
such GaAs & silicon chip. Very flexible and uses the scribe and break sequence that
keeps the finished die clean and free from damage.
During the breaking mode, the scribe 100 uses the rubber to hold the die as the linear
knife is raised to break along the core line. The film prevents contamination or stress
to the die.
All parameters are set from the control key boards, the machine is robust, vibration
free and requires minimal training to operate.
——————————————————————————————————————————————
Z motion with adjustable angle
Adjustable scribing force from 10g up to 80g; constant weight,
Additional weight in option,
Diamond Tool: Adjustable for angle & rotation
Tool Offset with cross-hair
Wafer chuck till 4’’
Die Size: Minimum 100µm square up to 10mmx10mm
Wafer thickness: 50µm and up
Manual rotation 90 degrees
Rotation alignment by micrometric screw
X Y Table / resolution 0,23µm
Motion control with progressive joystick weight
Optics & magnification compatible with application
Alignment: Programmable area / Manual
TFT monitors 22’’ and Color camera Ultra High definition
Electronic Zoom X10
LED lighting
Break mode: operator control or automatic
Breaking mode: Using top Rubber and bottom cutter
7" touch screen
Step Index and vertical interval
Y scribe speed from 0.1 to 20 mm/sec
Scribing length programmable
Repeat scribe
Number of scribe
Component number
Touchdown speed
Cutter speed
Cut counter
——————————————————————————————————————————
Power: 100 / 230VAC 1 kWatt
Air: 70psi
Vacuum: 100%, flow =15l/min
Dimensions: 650x820x1500mm (25x32x60)
Weight: 70kg
