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JFP PP6 Universal Die Bonder

The PP6 Universal Chip Bonder features a fully automated process and a micro-mounter, and it is used for small component packaging. It is also an epoxy adhesive chip bonder.

JFP PP6 Universal Die Bonderis the most versatile semi-automatic Flip-Chip Platform

    • Precise Placement Design:Designed for accurate placement of delicate devices on substrate.

    • High-Precision Optical System:It achieves high accuracy placement using high quality optical device.

    • Multi-Source Feeding and Ultrasonic Scrub Function:The machine provides for single collet vacuum pick and place of dies from waffle pack, wafer, Gel-Pak or bulk die media and features adjustable and repeatable subsonic scrub.

    • Full-Process Technological Capability:Flip Vision alignment for Small and large devices.

    • Offline Programming and Automated Sequencing:A full automated die bonding sequence with according epoxy pattern are programmable Off-Line… a simple matrix or multiple locations as well.

    • Anti-External Vibration Design:The PP6 is designed to be external vibration free.

    • Ergonomic Optimization:The PP6 is user friendly, flexible, and requires minimum training to operate.

 

 

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