PACTO-10H/20H Microwave Plasma System For Wafer Processing

Microwave Plasma System For Wafer Processing

ASTRO PACTO-10H/20H is a highly integrated microwave plasma descumming machine equipped with a temperature-controlled stage. It can meet the processes such as dry descumming of 2-inch to 12-inch wafers or wafer surface activation.

Wafer Surface Activation

Photoresist Removal

Removal of Epoxy Resins Such as PI and SU-8

MEMS Sacrificial Layer Removal (PI Release)

DESCUM (Bottom Layer Residue Removal)

 

Technical Parameters

 

Temperature control range: 1.9K – 400K continuous control 22

Temperature expansion: 50mK dilution refrigerator

             0.4K He3 Refrigerator

             1000K VSM high temperature furnace

Temperature scanning rate: 0.01 – 8 K/min (non-self-cycling model)

Temperature stability: ±0.2% T < 10K

                 ±0.02% T > 10K

Temperature control mode: fast mode, non-overshoot mode, scanning mode

 

Magnetic field range: Superconducting magnets included (optional):

              ±9T; ±14T; ±16T

Magnetic field resolution: 0.02 mT to 1 T

                 0.2 mT to 9 T

Magnetic field stability: 1PPM/hour

Field change rate: 10-200 Oe/s

Remanence: < 5 Oe (9T in oscillating mode)

Magnet operation modes: closed loop mode and drive mode

Magnetic field approach mode: Oscillation mode Non-overshoot mode    

                 Linear Mode Scan Mode

 

 

 

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