Wafer Surface Activation
Photoresist Removal
Removal of Epoxy Resins Such as PI and SU-8
MEMS Sacrificial Layer Removal (PI Release)
DESCUM (Bottom Layer Residue Removal)
Technical Parameters
Temperature control range: 1.9K – 400K continuous control 22
Temperature expansion: 50mK dilution refrigerator
0.4K He3 Refrigerator
1000K VSM high temperature furnace
Temperature scanning rate: 0.01 – 8 K/min (non-self-cycling model)
Temperature stability: ±0.2% T < 10K
±0.02% T > 10K
Temperature control mode: fast mode, non-overshoot mode, scanning mode
Magnetic field range: Superconducting magnets included (optional):
±9T; ±14T; ±16T
Magnetic field resolution: 0.02 mT to 1 T
0.2 mT to 9 T
Magnetic field stability: 1PPM/hour
Field change rate: 10-200 Oe/s
Remanence: < 5 Oe (9T in oscillating mode)
Magnet operation modes: closed loop mode and drive mode
Magnetic field approach mode: Oscillation mode Non-overshoot mode
Linear Mode Scan Mode