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光刻胶蚀刻残留物清洗剂 Emerging Cleans |
Customized Cleans Solutions ›EUV Surfactant Rinse (SR) Suitable for EUV photo resist to prevent pattern collapse›EUV Mask Cleans (MC) Perfect mask clean ability without CD loss›Si Etchant Series Si Etchant with high selectivity for SiO/SIN›Eco-friendly cleans solutions NMP free, catechol free, SPM & TMAH alternative processes |
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光刻胶蚀刻残留物清洗剂 Post-Patterning Cleans |
Photoresist Removers & Strippers›EKC830 to remove positivephotoresists with harsh process history›EKC865 to remove positive photoresists without damaging sensitive metals (Remover 1165)›EKC922 to remove both positive and negativephotoresists over cured or semi semi-cured polyimide without damaging |
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光刻胶蚀刻残留物清洗剂 LED, TSV, & WLP Cleans |
LED, TSV, WLP Cleans ›EKC162to remove photoresists used as TSV masks; wafer bumping by solder electroplating or stencil printing – Cu, GaAs compatible›EKC175to removes TSV similar process plasma-based photoresist residues, water-rinsable – Al compatible›EKC830to remove tough post-etch residues formed from dry etch TSV processes, enabling a defect-free via filling process›EKC922 to remove negative-tone photoresists. Compatible with gallium arsenide (GaAs) and an exceptionally broad array of metals |
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光刻胶蚀刻残留物清洗剂 Post-Etch Cleans |
Post-Etch Residue Removers (PERR) for Al & Cu Interconnects›EKC265to remove photoresist residue generated after etch processes. It is effective with or without oxygen ash processing›EKC270(T)to remove ashed photoresist residue, organic polymer, and organometallic etch residue, with improved Ti compatibility›EKC2100to clean post-etch residue and suitable for single wafer tool, good compatibility with LTO and ITO›EKC6800series to clean post-etch residue with compatibility with Al and Cu interconnect, low process temperature›EKC580/EKC590–to remove post-etch residues for Cu interconnect, semi aqueous chemistry compatible with ULK dielectric films |
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研磨后清洗剂 Post-CMP Cleans |
PCMP Cleans for FEOL (Ceria, Poly, Silica), MEOL (W), BEOL (Cu) Processes›PCMP2110系列Series Post-Ceria Slurry CMP Cleans, designed for cleaning wafers after use of ceria CMP slurries required in FEOL,MEOL and memory array layers›PCMP3210Series Post-CMP Tungsten Interconnect Cleans, compatible with both W and Co, very low defectivity on TEOS or SiN›EKC2100to clean post-etch residue and suitable for single wafer tool, good compatibility with LTO and ITO›PCMP5600Series Post-CMP Copper Interconnect Cleaners (PCMP5610/5620/5615/5650) |
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